| lltem |
2013 |
2014 |
2015 |
| Conventional rigid board |
Layer Count |
32 |
32 |
32 |
| Board thickness(mm) |
0.2-7.0 |
0.2-7.0 |
0.2-7.0 |
| Panel size(inch) |
22.5*30 |
22.5*42.5 |
22.5*42.5 |
| Inner Layer Trance/Space(mil) |
3.0/3.0 |
3.0/3.0 |
3/2.5 |
| Outer Layer Trance/Space(mil) |
3.0/3.0 |
3.0/3.0 |
3/2.5 |
| Impedance tolerance(Ω) |
±5(<50)±10%(≥50) |
±5(<50)±5%(≥50) |
±3(<50)±5%(≥50) |
| Maximum PTH aspect ratio |
24:1 |
30:1 |
30:1 |
| Minimum mechanical drill size(mil) |
6 |
6 |
6 |
| Distance between hole and trance(mil) |
5 |
4 |
4 |
| HDI |
3+C+3 |
S |
P |
M |
| 4+C+4 |
R&D |
S |
P&M |
| Microvia copper Fill |
M |
M |
M |
| Minimum microvia hole size(mil) |
4 |
4 |
4 |
| Minimum Target pad size of laser drilling(mil) |
8 |
8 |
8 |
| Rigid_filex board |
Layer Count/flex layer Count |
36/10 |
40/16 |
40/20 |
| Inner Layer Trance/Space(mil) |
3.5/3.5 |
3.5/3.5 |
3.5/3.5 |
| Outer Layer Trance/Space(mil) |
3.5/3.5 |
3.5/3.5 |
3.5/3.5 |
| Maximum PTH aspect ratio |
16:1 |
20:1 |
30:1 |
| Impedance |
10% |
10% |
10% |
| Minimum mechanical drill size(mil) |
8 |
6 |
6 |
| Distance between hole and trance(mil) |
6.5 |
6 |
6 |
| Special board/process |
Metal substrate |
Aluminum-substrate& copper-substrate |
Aluminum-substrate& copper-substrate |
Aluminum-substrate& copper-substrate |
| Metal_substrate depth controlled process capability(mm) |
±0.05 |
±0.05 |
±0.03 |
| Counter bore depth controlled capability(mm) |
±0.10 |
±0.10 |
±0.10 |
| Maximunm copper weight(OZ) |
10 |
10 |
10 |
| Heatsink Sweat Bonding,Ceramics (DBC),Metal-Buride PCB,Embedded Resistance/Embedded Capacitance/Embedded Capcitance,RF hybrid lamination,Microvia copper fill,Resin fill |
| Type of surface treatment |
Flash gold,lmmersion gold,Hard gold,Gold finger,HASL-LF,HASL,OSP,immersion tin,immersion silver,Soft gold,ENIG+OSP,ENIG+G/F,flash gold+G/F,immersion silver+G/F,and immersion tin+G/F |
| Remark |
R&D:Research and Development phase;S:Sample;P:Small volume;M:Mass Production |
