Technical capability

Technical capability

Board Type:
•     Single-sided and Multi-layer PCB (up to 32 layers)
•    Thick Copper (up to 6oz, based Cu 6oz inner layer, 5oz outer layer, 4oz with UL )
•     Thick Gold finishing (Up to 50u”)
•     Aluminum Base Material
•     Rogers+ Halogen-free FR-4 Hybrid
•     Counter Sink Design

 
Surface Finish:
•     Hot air leveling       Immersion gold               
•     Lead-free HAL       Immersion tin            Selective Gold Plating (Flash & Hard)
•     OSP                         Immersion silver       Selective OSP/HASL+Gold Finger

 
Technology:
•     RoHS/ Lead Free
•     HDI Microvias
•     Blind Vias
•     Buried Vias
•     Selective Plating
•     Impedance Control

 
Manufacturing Standard:
•     IPC-A-600G Class II
•     IPC-A-600G Class III
•     PERFAG 2E for Double-Sided Board
•     PERFAG 3C for Multilayer Board